1. Linear incandescent lamp（線型白熾燈）；
2. Mercury in switches（開關(guān)中的汞）；
3. Special ICs having tin-lead solder plating on leads used in professional equipment（專業(yè)設(shè)備中所含鍍有鉛錫焊料的鉛的特殊集成電路）；
4. Specific modular units including tin-lead solder being used in special professional equipment（特殊專業(yè)設(shè)備中包含鉛錫焊料的特定組合單元）；
5. Solders containing lead and /or cadmium for specific applications where local temperature is higher than 150 deg C and which need to work properly more than 500 hours（局部溫度超過150℃且需要正常工作500小時(shí)以上的特定用途的含有鉛和/或鎘的焊料）；
6. Lead in solder for printed circuit boards for emergency lighting products（應(yīng)急照明產(chǎn)品中印刷電路板所用焊料中的鉛）；
7. Hexavalent chromium (Cr-VI) in chromate conversion coatings as surface treatment（表面處理用鉻酸鹽轉(zhuǎn)化涂層中的六價(jià)鉻）；
8. Lead in gas sensors（煙霧探測器中的鉛）；
9. Concerning of PbO (Lead in Seal Frit) used for making BLU (Back Light Unit) Lamp（與用于制造背景燈的PbO（密封釉料中的鉛）相關(guān)的）；
10. Cadmium in opto-electronic components（光電元件中的鎘）；
11. Non-consumer mechanical power transmission systems including speed reducers and mechanical couplings which rely on electrical/electronic components for safe control and operation（依靠電子/電器元件來進(jìn)行**控制和操作的減速器和機(jī)械連接器等非消費(fèi)型機(jī)械式能量傳遞系統(tǒng)）；
12. Electrical and electronic components contained in heating ventilating and air conditioning building systems, commercial refrigeration systems and transport refrigeration systems（加熱通風(fēng)和空調(diào)建筑系統(tǒng)、商用冷卻系統(tǒng)和運(yùn)輸冷卻系統(tǒng)中的電子和電器元件）；
13. Cadmium-bearing copper alloys（含鎘的銅合金）；
14. Electrical/electronic components contained mobile and stationary air compressors and vacuum systems, compressed air contaminant removal systems and pneumatic contractor’s air tools（含有電子/電器元件的移動(dòng)和固定空氣壓縮機(jī)和真空系統(tǒng)、壓縮氣體污染物**系統(tǒng)和氣動(dòng)壓縮機(jī)的氣體工具）；
15. Electrical/electronic equipment that are: used in transport -aviation, aerospace, road, maritime, rail; installed in to the fabric of buildings ? elevators, escalators, moving walks, dumb waiters, and heating, cooling and ventilation systems, and fire and security systems; used in the energy generation and transmission; used in mining and mineral processing; used for non-consumer mechanical power transmission systems; industrial process pumps and compressors; used in industrial refrigeration; and used in military applications（以下電子/電氣設(shè)備：航運(yùn)、航天、道路、海運(yùn)、鐵路中使用的；建筑物構(gòu)造??電梯、電動(dòng)扶梯、移動(dòng)走道、小型運(yùn)貨升降機(jī)、加熱、冷卻和通風(fēng)系統(tǒng)、防火**系統(tǒng)中安裝的；能量產(chǎn)生和傳輸中使用的；采礦和礦石加工中使用的；非消費(fèi)型機(jī)械式能量傳遞系統(tǒng)中使用的；工業(yè)作用泵和壓縮機(jī)；工業(yè)制冷用的；**設(shè)備中使用的）；
16. Lead alloys as electrical/mechanical solder for transducers used in high-powered professional and commercial loudspeakers（大功率專業(yè)用和商用擴(kuò)音器中的傳感器中作為電氣/機(jī)械焊料的鉛合金）；
17. Cadmium oxide（氧化鎘）；
18. Solder tin of the thermo fuse with a defined low melting point（有固定低熔點(diǎn)的溫度保險(xiǎn)絲中的錫焊料）；
19. Lead in lead oxide glass used in plasma display panel (PDP)（氧化鉛玻璃等離子顯示器面板中使用的鉛）；
20. Lead in solder on small PCB and tinned legs of primary components（小型印刷電路板和初級(jí)元件的鍍錫引線所用焊料中的鉛）；
21. Use of the not lead free component NEC V25 in the Memor 2000（2000年備忘錄中非無鉛元件NEC V25的使用）；
22. Lead used in shielding of radiation for Non Medical X-ray equipment（非醫(yī)用X光機(jī)的射線防護(hù)屏中使用的鉛）；
23. Lead based solders sealed or captured within heat-shrinkable components and devices（熱收縮性元件和設(shè)備中密封或俘獲的鉛基焊料）.
